WIRE BOND, DIE ATTACH, GLOB TOP, SMT PROTOTYPE, PROCESS DEVELOPMENT DOE, LOW-MED VOLUME LOCATED AT SAN JOSE, SAN FRANCISCO BAY AREA
Die Bonding
We have a variety of capability to build prototype or low volume manufacturing.
Die Bond Process Capability:
- Epoxy Attach
Conductive Epoxy
Non-conductive Epoxy
- Eutectic Attach
Au-Sn
Other Lead-free Alloy (customer dependent)
- Conductive / Non-Conductive Die Attach Film (C-DAF/DAF)
- High Accuracy Die Attach
Packaging Applications:
- Small Die (150 microns)
- Large Die (10mm)
- Thin Die
- Thin Film
- Stacked Die
- Chip On Board Applications (CoB)
- System in Package (SiP)
Wire bonding
Wire Bonding Process Capability:
- Ball - Wedge
- Wedge - Wedge
- Ribbon Bond
- Stud Bumping
- Wedge on Ball
- Security Bumps
- Hybrid Prototype Requirement
Available Wire Type and Diameter:
- Au (0.7 to 3.0 mil)
- Al (0.7 to 2.0)
- Au/Al Ribbon Wire (customer application dependent)
- CuPd (Palladium coated copper wire)
Other Capabilities:
- Ultra Fine Pitch Capability
- Ultra Low Loop Capability
- Deep Access Capability
- Multi-layer Wire Loops
- High Density Wirebonding
- Room Temperature Bonding
- Plasma Cleaning Capability
- Measurement Capability
- Wire Pull and Ball Shear Testing
flip chip ATTACH
High Accuracy Flip Chip Attach
Our high accuracy machine will be able to support a flip chip process requirement over a range of application. The machine utilizes split beam optics to overlay the image from substrate and die to be attached. Several types of bonding can then be applied including but not limited to reflow soldering, eutectic attach, epoxy attach, UV snap cure attach.
(1) Rapid Prototype Partner
We are able to turn around parts in as fast as 1-3 days for standard attach and wire bond for up to 5 parts. If you already have a set of materials or if we have the materials available on hand, we can complete a rapid prototype as soon as possible.
(2) Pre-Production DOE and Characterization Assistance
(DOE) Design of Experiment or Simple Characterization
We help identify a DOE or a small characterization and validation around die bonding and wire bonding as well as other processes such as plasma cleaning, glob top, or several assembly preparation techniques. These are usually to understand the product performance, manufacturability, reliability, or scalability. This is a systematic characterization that helps mitigate the risk of a costly mistake on fabricating a final assembly and product tape out without risk assessment.
We generate custom reports regarding the results of your requested DOE. This report includes component measurements, wire pull test, ball shear test, and die shear testing if applicable, low and high power pictures. We also perform root cause analysis and recommend solutions to help in your design for manufacturing (DfM).
(3) Low to MEd Volume Manufacturing
Low to Medium Volume Manufacturing
We provide product execution road map from prototype, design for manufacturing transitioning into low or medium volume manufacturing. This includes BOM inventory procurement, ramp plans, process controls, yield reporting, and continuous improvement. We are governed by the QMS standards with ISO9001:2015 practices to deliver world class execution of our operations.