Die Bonding
We have a variety of capability to build prototype or low volume manufacturing.
Die Bond Process Capability:
- Epoxy Attach
Conductive Epoxy
Non-conductive Epoxy
- Eutectic Attach
Au-Sn
Other Lead-free Alloy (customer dependent)
- Die Attach Film (DAF)
- High Accuracy Die Attach
Packaging Applications:
- Small Die (150 microns)
- Large Die (Customer specifies)
- Thin Die
- Stacked Die
- Chip On Board Applications (CoB)
- System in Package (SiP)
Wire bonding
Wire Bonding Process Capability:
- Ball - Wedge
- Wedge - Wedge
- Ribbon Bond
- Stud Bumping
- Wedge on Ball
- Security Bumps
- Hybrid Prototype Requirement
Available Wire Type and Diameter:
- Au (0.7 to 3.0 mil)
- Al (0.7 to 2.0)
- Au/Al Ribbon Wire (customer application dependent)
- CuPd (Palladium coated copper wire)
Other Capabilities:
- Ultra Fine Pitch Capability
- Ultra Low Loop Capability
- Deep Access Capability
- Multi-layer Wire Loops
- High Density Wirebonding
- Room Temperature Bonding
- Plasma Cleaning Capability
- Measurement Capability
- Wire Pull and Ball Shear Testing
flip chip ATTACH
High Accuracy Flip Chip Attach
Our high accuracy machine will be able to support a flip chip process requirement over a range of application. We have capability of several die sizes and a wide range of temperature for the attach process.
We can deliver on very complex assembly requirement. Please don't hesitate to contact our team to help you navigate thru the packaging designs and feasibility. We are conveniently located in San Francisco, Bay Area.
WIRE BONDING Characterization Support
Wirebondability
Customers often need a simple feedback on wirebondability due to the metallization stack-up or space limitations before design tape out. This is an area where S&C Micro excels because we understand the need to have fast and reliable data for your prototype.
Design of Experiment (DOE)
You may want to know what is the best parameter to support your high volume high yield product or processes. It could be around temperature, cleanliness, material composition or stack up assessment. This is a systematic characterization that helps mitigate the risk of a costly mistake.
Complete Feedback Loop
We generate custom reports with low power and high power photos. This report includes component measurements, wire pull test, ball shear test, and die shear testing if applicable. We also perform root cause analysis and recommend solutions to help in your design for manufacturing.
Micro Assembly Packaging and Prototype
We are always thrilled with innovative ideas for the advancement of technology. Our core team has over 20+ years of experience in the industry from prototyping to high volume manufacturing around the world. We know what it takes to successfully demonstrate a reliable micro-assembly process and package.
S&C Micro operates in San Francisco, Bay Area with an ISO7 cleanroom environment and state-of-the-art equipment. The platforms are highly flexible and accommodate almost any product form factor. These are high precision, high accuracy, repeatable, and reliable machines that can support prototypes and low volume production.
New Product Introduction (NPI) to High Volume Manufacturing
New Product Introduction (NPI) to High Volume Manufacturing
While we specialize in prototype with die attach, wire bonding and low volume manufacturing, we also offer product transfer capability complete with documentation of an optimized assembly processes and packaging specifications. You will have access to our team seasoned with leadership experience to execute a successful product/technology transfer to contract manufacturing world wide.