We believe in supporting technology advancement by providing fast turn around high quality service that closes the technical gap between prototyping and volume manufacturing. Initial DOE and characterization is important to be co-located with designers and developers for a fast feedback response on material and process down selection. This enables for a high quality high performing product to be cost effective in automated manufacturing.
Our investment is on a state-of-the-art capital equipment that enables flexibility and automation. Our highly skilled team with 20+ years of experience in the micro-assembly packaging processes can provide unique and creative solutions while utilizing mainstream processes and machines. We specialize in die bonding, wire bonding, low volume manufacturing, and high-volume contract manufacturing product transfer.
Located in San Francisco, California, we are a US-based service that offers prototype assembly line and low volume manufacturing. We partner with our customers to provide assembly design feedback, technical support, and project management support on:
(1) Prototype Phase (2) Low Volume Phase (3) High Volume Phase
Die Bond Process Capability:
Other Lead-free Alloy (customer dependent)
Wire Bonding Process Capability:
Available Wire Type and Diameter:
Our high accuracy machine will be able to support a flip chip process requirement over a range of application. We have capability of several die sizes and a wide range of temperature for the attach process.
We can deliver on very complex assembly requirement. Please don't hesitate to contact our team to help you navigate thru the packaging designs and feasibility. We are conveniently located in San Francisco, Bay Area.
Customers often need a simple feedback on wirebondability due to the metallization stack-up or space limitations before design tape out. This is an area where S&C Micro excels because we understand the need to have fast and reliable data for your prototype.
You may want to know what is the best parameter to support your high volume high yield product or processes. It could be around temperature, cleanliness, material composition or stack up assessment. This is a systematic characterization that helps mitigate the risk of a costly mistake.
We generate custom reports with low power and high power photos. This report includes component measurements, wire pull test, ball shear test, and die shear testing if applicable. We also perform root cause analysis and recommend solutions to help in your design for manufacturing.
We are always thrilled with innovative ideas for the advancement of technology. Our core team has over 20+ years of experience in the industry from prototyping to high volume manufacturing around the world. We know what it takes to successfully demonstrate a reliable micro-assembly process and package.
S&C Micro operates in San Francisco, Bay Area with an ISO7 cleanroom environment and state-of-the-art equipment. The platforms are highly flexible and accommodate almost any product form factor. These are high precision, high accuracy, repeatable, and reliable machines that can support prototypes and low volume production.
While we specialize in prototype with die attach, wire bonding and low volume manufacturing, we also offer product transfer capability complete with documentation of an optimized assembly processes and packaging specifications. You will have access to our team seasoned with leadership experience to execute a successful product/technology transfer to contract manufacturing world wide.