What We Do

We help build products that utilizes die bonding and wire bonding technology with our state-of-the-art equipment and tooling set that is highly flexible with a wide range of capability.

We own a process and technology database that continuously improve our performance and machine technology as we partner up with our customers, vendors, and suppliers.

Our mission is to enable innovation by being a part of the solution to the challenges in building new technology.

Located in the San Francisco Bay Area, California, we are a US-based, technology company that provides the following core services:

(1) Rapid Prototype Partner

(2) Pre-Production DOE and Characterization Assistance

(3) Low to Med Volume Manufacturing

Applications Capability

Medical Applications
Opto Electronics
Semiconductor
VR Applications
AI Applications
Automotive Applications
Solar Technology
3D IC Packaging
MEMS Technology
RF and Microwave Applications
Other Challenging Technology

Die Bonding

We have a variety of capability to build prototype or low volume manufacturing.

Die Bond Process Capability:

Epoxy Attach

Conductive Epoxy

Non-conductive Epoxy

Eutectic Attach

Au-Sn

Other Lead-free Alloy (customer dependent)

Die Attach Film (DAF)
High Accuracy Die Attach

Packaging Applications:

Small Die (150 microns)
Large Die (Customer specifies)
Thin Die
Stacked Die
Chip On Board Applications (CoB)
System in Package (SiP)

Wire bonding

Wire Bonding Process Capability:

Ball - Wedge
Wedge - Wedge
Ribbon Bond
Stud Bumping
Wedge on Ball
Security Bumps
Hybrid Prototype Requirement

Available Wire Type and Diameter:

Au (0.7 to 3.0 mil)
Al (0.7 to 2.0)
Au/Al Ribbon Wire (customer application dependent)
CuPd (Palladium coated copper wire)

Other Capabilities:

Ultra Fine Pitch Capability
Ultra Low Loop Capability
Deep Access Capability
Multi-layer Wire Loops
High Density Wirebonding
Room Temperature Bonding
Plasma Cleaning Capability
Measurement Capability
Wire Pull and Ball Shear Testing

flip chip ATTACH

High Accuracy Flip Chip Attach

Our high accuracy machine will be able to support a flip chip process requirement over a range of application. We have capability of several die sizes and a wide range of temperature for the attach process.

(1) Rapid Prototype Partner

Specializing in die bonding and wire bonding technology, we are always thrilled with innovative ideas for the advancement of technology. Our core team has over 60+ years of combined experience in the industry from prototyping to high volume manufacturing around the world. This experience allow us create a database of "Known Good Parameter" that we use as a starting point for our prototype service. Thus we can commit to a fast turn around time.

(2) Pre-Production DOE and Characterization Assistance

(DOE) Design of Experiment or Simple Characterization

We help identify a DOE or a small characterization and validation around die bonding and wire bonding. It could be on understanding the temperature, cleanliness, material composition or stack up assessment, and other parameters that affects product performance. This is a systematic characterization that helps mitigate the risk of a costly mistake.

We generate custom reports regarding the results of your requested DOE. This report includes component measurements, wire pull test, ball shear test, and die shear testing if applicable, low and high power pictures. We also perform root cause analysis and recommend solutions to help in your design for manufacturing (DfM).

(3) Low to MEd Volume Manufacturing

Low to Medium Volume Manufacturing

We provide product execution road map from prototype, design for manufacturing transitioning into low or medium volume manufacturing. This includes BOM inventory procurement, ramp plans, process controls, yield reporting, and continuous improvement. We are governed by the QMS standards with ISO9001:2015 practices to deliver world class execution of our operations.