QUICK TURN PROTOTYPE WIRE BOND, FLIP CHIP ATTACH, DIE ATTACH
QUICK TURN PROTOTYPE WIRE BOND, FLIP CHIP ATTACH, DIE ATTACH
We help build products that utilizes die attach and wire bonding technology with our state-of-the-art equipment and tooling set that is highly flexible with a wide range of capability.
Located in the San Francisco Bay Area, California, we are a US-based, technology company that provides the following core services:
(1) Rapid Prototype Partner
(2) Pre-Production DOE and Characterization Assistance
(3) Low to Med Volume Manufacturing
Open today | 09:00 am – 05:00 pm |
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