WIRE BONDING, WIRE BONDING MACHINE, FLIP CHIP ATTACH, DIE ATTACH, GLOB TOP, SMT PROTOTYPE, PROCESS DEVELOPMENT DOE, LOW-MED VOLUME LOCATED AT SAN JOSE, SAN FRANCISCO BAY AREA

S&C Micro
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S&C Micro
  • Home
  • Contact US
  • Services
  • Careers
  • Request a Quote

Welcome

We help build products that utilizes die attach and wire bonding technology with our state-of-the-art equipment and tooling set that is highly flexible with a wide range of capability. 

  

Located in the San Francisco Bay Area, California, we are a US-based, technology company that provides the following core services:

(1) Rapid Prototype Partner

(2) Pre-Production DOE and Characterization Assistance

(3) Low to Med Volume Manufacturing

Find out more

Contact Us for your die attach and wire bonding needs!

Request a Quote

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S&C Micro, Inc.

2456 Armstrong Street, Livermore, California 94551, United States

(408) 883-4953

Hours

Open today

09:00 am – 05:00 pm


Copyright © 2021 S&C Micro - All Rights Reserved.

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