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Stay updated with the latest advancements in microelectronics packaging with S&C Micro. From wire bonding innovations to flip chip attach techniques, explore cutting-edge solutions driving the industry forward.
Wire Bonding In Micro System Integration

With the modern age bringing increasingly extensive and complex design applications, wire bonding is one of the most sophisticated processes of all assembly operations. Every individual wire is bonded into its designated shape to fit the specific application. This precision ...