Wire Bond, Die Attach, Glob Top, SMT Prototype, DOE, Low-Med Volume
Located in the San Francisco Bay Area, we provide die bonding and wire bonding for rapid prototype or volume manufacturing.
Eutectic Attach
Non-conductive epoxy
Eutectic Attach
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Thermo Compression Bonding
Flip Chip and Under Fill
Ball-Wedge
Wedge-Wedge
Ribbon Bonding
Stud Bumping
Hybrid
Metalization wire bonding and bondability check
Personalized report with low power and high power photos.
Wire pull and shear testing.
Prototype assembly
Packaging design feedback
Design for Manufacturing Assessment
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Low to Medium Volume Capacity for Microelectronics Assembly
Coming Soon
