Micro-Assembly Packaging Solutions
S&C Micro
We provide services specializing in die bonding and wire bonding
Located in the San Francisco Bay Area, we provide die bonding and wire bonding for rapid prototype or volume manufacturing.
Die Bonding
Flip Chip and Underfill
Flip Chip and Underfill
Eutectic Attach
Non-conductive epoxy
Eutectic Attach
Flip Chip and Underfill
Flip Chip and Underfill
Flip Chip and Underfill
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Thermo Compression Bonding
Flip Chip and Under Fill
Wire Bonding
Flip Chip and Underfill
Die Bond and Wire Bonding Characterization Support
Ball-Wedge
Wedge-Wedge
Ribbon Bonding
Stud Bumping
Hybrid
Die Bond and Wire Bonding Characterization Support
Die Bond and Wire Bonding Characterization Support
Die Bond and Wire Bonding Characterization Support
Metalization wire bonding and bondability check
Personalized report with low power and high power photos.
Wire pull and shear testing.
Rapid Prototyping
Die Bond and Wire Bonding Characterization Support
Low to Medium Manufacturing
Prototype assembly
Packaging design feedback
Design for Manufacturing Assessment
Low to Medium Manufacturing
Die Bond and Wire Bonding Characterization Support
Low to Medium Manufacturing
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Low to Medium Volume Capacity for Microelectronics Assembly