WIRE BONDING, FLIP CHIP ATTACH, DIE ATTACH, GLOB TOP, PROTOTYPE, PROCESS DEVELOPMENT
Located in Livermore California, San Francisco Bay Area,
Rapid Prototype, Design Review, NPI Services
Die Attach
Flip Chip Attach
Eutectic Attach
Non-conductive epoxy
Eutectic Attach
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Thermo Compression Bonding
Flip Chip Attach and Under Fill
Wire Bonding
Ball-Wedge
Wedge Bond
Ribbon Bonding
Stud Bumping
Hybrid
Metalization wire bonding and bondability check
Personalized report with low power and high power photos.
Wire pull and shear testing.
Flip Chip Attach
Ball, Ribbon, and Wedge bond
San Jose, San Francisco Bay Area services
Low to Medium Volume Capacity for Microelectronics Assembly.
Die Attach, Flip Chip Attach, Wire Bonding, Wire Bonding Machines
San Jose, San Francisco Bay Area
Coming Soon
