Wire Bonding In Micro System Integration
With the modern age bringing increasingly extensive and complex design applications, wire bonding is one of the most sophisticated ...
Our mission is to enable innovation by being a part of the solution to the challenges in building new technology.
Wire Bond, Die Attach, Flip Chip Attach, Eutectic Attach, Non-conductive Epoxy, Eutectic Attach.
Low to Medium Volume Capacity for Microelectronics Assembly. Die Attach, Flip Chip Attach, Wire Bonding, Wire Bonding Machines.
Advanced Packaging Characterization, Wire Pull and Shear Testing. Die Attach, Wire Bonding, Flip Chip Attach, Ball, Ribbon, and Wedge bond, San Francisco Bay Area Services.
We help build products that utilizes die attach & wire bond technology with our state-of-art equipment & tooling set thats highly flexible with wide range of capability.
With the modern age bringing increasingly extensive and complex design applications, wire bonding is one of the most sophisticated ...
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