WIRE BONDING, WIRE BONDING MACHINE, FLIP CHIP ATTACH, DIE ATTACH, GLOB TOP, SMT PROTOTYPE, PROCESS DEVELOPMENT DOE, LOW-MED VOLUME LOCATED AT SAN JOSE, SAN FRANCISCO BAY AREA
Located in San Jose, San Francisco Bay Area, we provide die attach, flip chip attach, wire bonding for rapid prototype or volume manufacturing. We have state of the art wire bonding machines.
Die Attach
Flip Chip Attach
Eutectic Attach
Non-conductive epoxy
Eutectic Attach
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Thermo Compression Bonding
Flip Chip Attach and Under Fill
Wire Bonding
Ball-Wedge
Wedge Bond
Ribbon Bonding
Stud Bumping
Hybrid
Metalization wire bonding and bondability check
Personalized report with low power and high power photos.
Wire pull and shear testing.
Flip Chip Attach
Ball, Ribbon, and Wedge bond
San Jose, San Francisco Bay Area services
Process Development for Die Attach, Flip Chip Attach, Wire Bonding
Prototype assembly
Packaging design feedback compatible for wire bonding machines
Design for Manufacturing Assessment
San Jose, San Francisco Bay Area
Low to Medium Volume Capacity for Microelectronics Assembly.
Die Attach, Flip Chip Attach, Wire Bonding, Wire Bonding Machines
San Jose, San Francisco Bay Area
Coming Soon
