S&C Micro, Inc.
Specializing in Micro-Assembly Packaging, Die Attach, Wire Bonding Services
Located in San Francisco Bay Area, we provide micro-assembly die attach and wire bonding for prototype and manufacturing.
Die Bonding
Flip Chip and Underfill
Flip Chip and Underfill
Eutectic Attach
Non-conductive epoxy
Euetectic Attach
Flip Chip and Underfill
Flip Chip and Underfill
Flip Chip and Underfill
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Thermo Compression Bonding
Coming Soon
Wire Bonding
Flip Chip and Underfill
Wire Bonding Characterization Support
Ball-Wedge
Wedge-Wedge
Ribbon Bonding
Stud Bumping
Hybrid
Wire Bonding Characterization Support
New Product Introduction (NPI) to High Volume Manufacturing (HVM) Support
Wire Bonding Characterization Support
Metalization wire bonding and bondability check
Personalized report with low power and high power photos.
Wire pull and shear testing.
Micro Assembly Packaging and Prototyping
New Product Introduction (NPI) to High Volume Manufacturing (HVM) Support
New Product Introduction (NPI) to High Volume Manufacturing (HVM) Support
Prototype assembly
Packaging design feedback
Design for Manufacturing Assessment
New Product Introduction (NPI) to High Volume Manufacturing (HVM) Support
New Product Introduction (NPI) to High Volume Manufacturing (HVM) Support
New Product Introduction (NPI) to High Volume Manufacturing (HVM) Support
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Let us assist you in transferring your product from prototype to a low cost high volume contract manufacturing.