WIRE BONDING, BALL, RIBBON, and WEDGE BONDING, FLIP CHIP DIE ATTACH, GLOB TOP, SMT PROTOTYPE, PROCESS DEVELOPMENT DOE, LOW-MED VOLUME LOCATED AT SAN JOSE, SAN FRANCISCO BAY AREA
Die Attach
Flip Chip and Underfill
Flip Chip and Underfill
Die Attach
Flip Chip Attach
Eutectic Attach
Non-conductive epoxy
Eutectic Attach
Flip Chip and Underfill
Flip Chip and Underfill
Flip Chip and Underfill
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Thermo Compression Bonding
Flip Chip Attach and Under Fill
Wire Bonding
Flip Chip and Underfill
DOE and Characterization Support
Wire Bonding
Ball-Wedge
Wedge Bond
Ribbon Bonding
Stud Bumping
Hybrid
DOE and Characterization Support
DOE and Characterization Support
DOE and Characterization Support
Metalization wire bonding and bondability check
Personalized report with low power and high power photos.
Wire pull and shear testing.
Flip Chip Attach
Ball, Ribbon, and Wedge bond
Rapid Prototyping
DOE and Characterization Support
Low to Medium Manufacturing
Process Development for Die Attach, Wire Bonding
Prototype assembly
Packaging design feedback
Design for Manufacturing Assessment
San Jose, San Francisco Bay Area
Low to Medium Manufacturing
DOE and Characterization Support
Low to Medium Manufacturing
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Low to Medium Volume Capacity for Microelectronics Assembly.
Die Attach, Wire Bonding,
San Jose, San Francisco Bay Area
Surface Mount Technology(SMT)
Surface Mount Technology(SMT)
Surface Mount Technology(SMT)
Coming Soon
