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Welcome to S&C Micro

Wirebond, Flip Chip Attach, Die Attach, Wire Bonding, Quick Turn Prototype

Quick Turn Prototype Wirebond, Die Attach, Flip Chip Attach in San Jose and San Francisco Bay Area. ITAR Registered, US based.
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About S&C Micro

What We Do

Our Mission

Our mission is to enable innovation by being a part of the solution to the challenges in building new technology.

Located in the San Francisco Bay Area, California, we are a US-based, technology company that provides the following core services:
  • Rapid Prototype Partner
  • Pre-Production DOE & Characterization
  • Low to Med Volume Manufacturing
  • Die Attach
  • Flip Chip Attach
  • Wirebonding (Au, Al)
  • Encapsulation
  • Prototype work with special instructions

Community AND CERTIFICATION

Our Services

Services We Offer

Die Attach

Wire Bond, Die Attach, Flip Chip Attach, Eutectic Attach, Non-conductive Epoxy, Eutectic Attach.

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Flip Chip & Underfill

Thermo Compression Bonding, Flip Chip Attach and Under Fill.

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Flip chip

Wirebond

Wire Bonding, Ball-Wedge, Wedge Bond, Ribbon Bonding, Stud Bumping, Hybrid.

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bond attachment

Low to Medium Manufacture

Low to Medium Volume Capacity for Microelectronics Assembly. Die Attach, Flip Chip Attach, Wire Bonding, Wire Bonding Machines.

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Wirebond

DOE & Characterization Support

Advanced Packaging Characterization, Wire Pull and Shear Testing. Die Attach, Wire Bonding, Flip Chip Attach, Ball, Ribbon, and Wedge bond, San Francisco Bay Area Services.

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We help build products that utilizes die attach & wire bond technology with our state-of-art equipment & tooling set thats highly flexible with wide range of capability.

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S&C Micro Careers

Join our team of die attach and wire bonding process development experts!

At S&C Micro, we believe that a great company is defined by the values of its work force. Therefore, we take pride on defining and meeting the needs of our employees. We offer competitive compensation and health benefits, as well as flexible hours and work from home arrangements. Contact us to find out more!
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wire bonding
Wire bond
Die Bonding
Die Attach
Get In Touch

Better yet, see us in person!

Feel free to visit during normal business hours. Located in close proximity to San Jose and the San Francisco, Bay Area. We would love to show you our capabilities in advanced packaging specializing on wire bonding, flip chip attach, die attach, wire bonding machines.

S&C Micro

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Drop us a line!

Contact us for your die attach and wire bonding needs!
Our Blog

S&C Micro Related News

Stay updated with the latest advancements in microelectronics packaging with S&C Micro. From wire bonding innovations to flip chip attach techniques, explore cutting-edge solutions driving the industry forward.
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Quick Turn Prototype Wirebond, Die Attach, Flip Chip Attach in San Jose and San Francisco Bay Area. ITAR Registered, US based.
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Contact Info
Phone No.

(408) 883-4953

Email Address

contact@scmicro.tech

Location

2456 Armstrong Street, Livermore, California 94551

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