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Services

Our Services

What We Do

Our mission is to enable innovation by being a part of the solution to the challenges in building new technology.
Located in the San Francisco Bay Area, California, we are a US-based, technology company that provides the following core services:

Die Bonding

We have a variety of capability to build prototype or low volume manufacturing.
Die Bond Process Capability:
  • Epoxy Attach

              Conductive Epoxy
              Non-conductive Epoxy
              Die Attach Film (Conductive and Non-Conductive)

  • Eutectic Attach

              Au-Sn
              Other Lead-free Alloy (Customer dependent)

  • Conductive / Non-Conductive Die Attach Film (C-DAF/DAF)
  • High Accuracy Die Attach
  • Flip Chip Attach

Wire bonding

Wire Bond Die Attach Flip Chip Prototype Manufacturing.
Wire Bonding Process Capability:
  • Ball – Wedge 
  • Wedge – Wedge
  • Ribbon Bond
  • Stud Bumping
  • Wedge on Ball
  • Security Bumps
  • Hybrid Prototype Requirement
Available Wire Type and Diameter:
  • Au (0.7 to 3.0 mil)
  • Aluminum (0.7 to 2.0)
  • Au/Al Ribbon Wire (customer application dependent)
  • CuPd (Palladium coated copper wire)
Other Capabilities:
  • Ultra Fine Pitch Capability
  • Ultra Low Loop Capability
  • Deep Access Capability
  • Multi-layer Wire Loops
  • High Density Wirebonding
  • Room Temperature Bonding
  • Plasma Cleaning Capability
  • Measurement Capability
  • Wire Pull and Ball Shear Testing
Announce coming events
Having a big sale, on-site celebrity, or other event? Be sure to announce it so everybody knows and gets excited about it.
Flip chip

Flip Chip Attach

High Accuracy Flip Chip Attach
Our high accuracy machine will be able to support a flip chip process requirement over a range of application. The machine utilizes split beam optics to overlay the image from substrate and die to be attached. Several types of bonding can then be applied including but not limited to reflow soldering, eutectic attach, epoxy attach, UV snap cure attach.
(1) Rapid Prototype Partner
We are able to turn around parts in as fast as same day delivery for standard attach and wire bond.
Contact us to request and book a time frame for rapid prototyping.
Die Bonding

Pre-Production DOE and Characterization

(DOE) Design of Experiment or Assembly Characterization
We help identify a DOE or assembly characterization and validation around die bonding and wire bonding as well as other processes such as plasma cleaning, glob top, or several assembly preparation techniques. These are usually to understand the product performance, manufacturability, reliability, or scalability. This is a systematic characterization that helps mitigate the risk of a costly mistake on fabricating a final assembly and product tape out without risk assessment.
We generate custom reports regarding the results of your requested DOE. This report includes component measurements, wire pull test, ball shear test, and die shear testing if applicable, low and high power pictures. We also perform root cause analysis and recommend solutions to help in your design for manufacturing (DfM).
Wirebond

Low to Medium Volume Manufacturing

Low to Medium Volume Manufacturing
We provide product execution road map from prototype, design for manufacturing transitioning into low or medium volume manufacturing. This includes BOM inventory procurement, ramp plans, process controls, yield reporting, and continuous improvement. We are governed by the QMS standards with ISO 9001:2015 practices to deliver world class execution of our operations.
Get In Touch

Ways to reach out

Call

(408) 883-4953

Email

contact@scmicro.tech

Visit

2456 Armstrong Street, Livermore, California 94551, United States

S&C MICRO logo
Quick Turn Prototype Wirebond, Die Attach, Flip Chip Attach in San Jose and San Francisco Bay Area. ITAR Registered, US based.
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Contact Info
Phone No.

(408) 883-4953

Email Address

contact@scmicro.tech

Location

2456 Armstrong Street, Livermore, California 94551

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