Wire Bonding In Micro System Integration

Wire Bonding In Micro System Integration

With the modern age bringing increasingly extensive and complex design applications, wire bonding is one of the most sophisticated processes of all assembly operations.

Every individual wire is bonded into its designated shape to fit the specific application. This precision is what allows for micro system integration. It is used in everything from aerospace and minimally invasive sensorized medical devices to automotive electronics.

Although the product is miniature, the impact is immense.

S&C MICRO

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