QUICK TURN PROTOTYPE WIRE BOND, FLIP CHIP ATTACH, DIE ATTACH, GLOB TOP, PROTOTYPE
Quick Turn Prototype Wirebond, Die Attach, Flip Chip Attach in San Jose and San Francisco Bay Area. ITAR Registered, US based
Wire Bond
Die Attach
Flip Chip Attach
Eutectic Attach
Non-conductive epoxy
Eutectic Attach
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Thermo Compression Bonding
Flip Chip Attach and Under Fill
Wire Bonding
Ball-Wedge
Wedge Bond
Ribbon Bonding
Stud Bumping
Hybrid
Advanced Packaging Characterization
Wire pull and shear testing.
Die Attach
Wire Bonding
Flip Chip Attach
Ball, Ribbon, and Wedge bond
San Jose, San Francisco Bay Area services
Low to Medium Volume Capacity for Microelectronics Assembly.
Die Attach, Flip Chip Attach, Wire Bonding, Wire Bonding Machines
San Jose, San Francisco Bay Area
