WIRE BONDING, WIRE BONDING MACHINE, FLIP CHIP ATTACH, DIE ATTACH, GLOB TOP, SMT PROTOTYPE, PROCESS DEVELOPMENT DOE, LOW-MED VOLUME LOCATED AT SAN JOSE, SAN FRANCISCO BAY AREA
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Hello
Join our team of die attach and wire bonding process development experts!
At S&C Micro, we believe that a great company is defined by the values of its work force. Therefore, we take pride on defining and meeting the needs of our employees. We offer competitive compensation and health benefits, as well as flexible hours and work from home arrangements. Contact us to find out more!
Current job openings
Packaging Engineer
REQUIREMENT:
- B.S. in Mechanical, Electrical, Electronics, or Material Science
- 5+ years experience in die bonding, wire bonding, flip chip attach, glob top, underfill, die attach and wire bonding process development.
- Hands-on experience in machine set-up and operation for die bonders and wire bonders (manual, semi-automatic, fully automatic)
- Proficient in root cause and failure mode analysis
- Familiar with cleanroom and ESD protocols
- Knowledgeable on micro electronic packaging design rules
- Flexible and adaptable to changing priorities
- Eagerness to learn and mentor team members
JOB DESCRIPTION:
- Gather and review customer requirement
- Close loop feedback with the customers
- Hands-on machine set-up and operation for die bond, wire bond, wire pull/shear testers, high power microscopes
- Responsible for defining process parameters and optimization on prototype or volume product and processes
- Develop cure profiles for several epoxy and applications
- Document process procedures on critical operations
- Generate customer specific report and summary on projects handled
- Observe safety, cleanroom, and ESD protocols
- Located at Livermore, near San Jose, San Francisco Bay Area
Process Technician
REQUIREMENT:
- 2+ years experience in hands-on micro packaging assembly that includes processes such as die bonding, wire bonding, dispensers, flip chip attach, and underfill
- Familiar with micro assembly equipment that range from manual, semi-auto, or fully automatic die bonders, wire bonders, testers, and microscopes.
- High dexterity for handling small components in prototype assembly environment
- Familiar with cleanroom and ESD protocols
- Able to trouble shoot basic issues with machines
- Eagerness to learn and mentor team members
JOB DESCRIPTION:
- Hands-on machine set-up and operation for die bond, wire bond, wire pull/shear testers, dispensers, ovens, and high power microscopes
- Hands-on manual assembly where necessary
- Perform material quality inspection
- Work closely with engineers to constantly improve quality and process operations
- Observe safety, cleanroom, and ESD protocols