At SC Micro Tech, we empower Washington D.C.’s industries with cutting-edge microtechnology solutions designed for precision, reliability, and performance — driving innovation and unlocking new possibilities for advanced manufacturing and smart systems.
At S&C Micro, we specialize in advanced microelectronics services built around innovation, precision, and reliability. Based in Washington D.C., we support companies from early-stage prototyping to low and medium-volume production, offering solutions that meet the complex demands of today’s tech-driven world. Whether you need die bonding, flip chip attach, or wire bonding, we deliver tailored services that bring your ideas to life.
Our engineering expertise combined with cutting-edge equipment enables us to provide support across multiple industries including aerospace, medical, automotive, and defense. From pre-production DOE to manufacturing, our Washington D.C. team ensures tight process control and consistency throughout every project.
About S&C Micro
S&C Micro is a precision microelectronics assembly partner located in Washington D.C., focused on helping technology companies reduce development cycles and bring high-performance products to market faster. We provide a range of services from prototyping to manufacturing support, using proven techniques like die bonding, flip chip attach, and wire bonding.
Our facility in Washington D.C. is equipped with the tools and expertise needed to meet the rigorous standards of industries such as aerospace, medical, and defense. Every project is approached with a commitment to quality, traceability, and flexibility—allowing our clients to innovate with confidence. With decades of combined experience in packaging and process development, our engineers work side by side with clients to deliver solutions that work, scale, and endure.
We begin by reviewing your project goals, technical specs, and timeline. This helps us define the right approach, materials, and process flow to meet your performance requirements.
Our team designs and runs a tailored DOE (Design of Experiment), followed by testing and analysis. This step ensures process reliability, material compatibility, and product functionality before production.
Once validated, we transition to controlled manufacturing using strict process documentation and traceability. Finished assemblies are delivered on schedule with full quality assurance and post-delivery support if needed.
Our team brings decades of hands-on experience in microelectronics packaging, enabling us to solve complex challenges and deliver reliable assembly solutions across aerospace, medical, defense, and advanced tech sectors.
We don’t offer one-size-fits-all solutions. Instead, we collaborate directly with your engineers to develop customized processes that align with your device requirements, budget, and production timeline.
Whether you need a single prototype or thousands of assemblies, our Washington D.C.-based facility is built for low to medium volume production with consistent quality and reliable turnaround times.
We maintain full traceability, process documentation, and inspection checkpoints throughout every project stage. This ensures consistent quality and compliance with strict performance and reliability standards.
Yes, we support the full microelectronics lifecycle from development and testing to scalable manufacturing and final inspection.
Absolutely. We specialize in helping teams accelerate development through fast-turn prototyping and detailed DOE validation.
Our processes are built on tight controls, documentation, and extensive testing to meet rigorous industry standards and client requirements.
We combine hands-on engineering, responsive service, and flexible production capabilities—all under one roof in Washington D.C..
While we specialize in packaging and assembly, we work closely with clients handling both analog and digital ICs to ensure seamless integration.
(408) 883-4953
contact@scmicro.tech
2456 Armstrong Street, Livermore, California 94551
Copyrights © 2025 S&C Micro